NEWEST INTEL AND AMD PROCESSOR ARCHITECTURES FOR COMPUTERS AND LAPTOPS

Abstract

The big tech companies Intel and AMD traditionally release new processor architectures with significant updates towards the end of the year. The current year continues this trend and tradition. The new x86- 64 processor architectures for computers and laptops are considered. The approaches of Intel and AMD companies are described. Information is provided about the new Intel Lunar Lake processor architecture for laptops. Details about the new Intel Arrow Lake processor architecture for computers are presented. The lack of Hyper-Threading support in Arrow Lake is mentioned. Information is given about the new AMD Zen 5 processor architecture. The new AMD Strix Point processor architecture for laptops is reviewed. Two main tiles of Lunar Lake are described: Compute and Platform Controller. The Lion Cove P-Core is examined. The Skymont E-Core is investigated. The number of P-cores and E-cores in the Arrow Lake family processors is presented. A review of AMD Ryzen 9000 series processors is conducted, and their technical specifications are described. Technological improvements in the AMD Ryzen 9000 series processors are provided. Changes in TDP for these processors are discussed. Information is given about the compact Zen 5c cores. Differences from previous models based on the Zen 4 architecture are highlighted. The increase in IPC in the Zen 5 architecture is noted. A review has been conducted on the innovation in the Zen 5 architecture related to the expansion of the instruction execution mechanism to an 8-bit structure. This is important because Zen 4 and all previous Zen architectures used a 6-bit executionmechanism. Numerical data about important technical improvements in Intel and AMD processors are presented. Information about the NPU (Neural Processing Unit) is provided. Two top models based on the Ryzen AI 300 paradigm are considered. Their technical features are analyzed. Their performance and energy efficiency are examined. TDP values of the Ryzen AI 300 chips are presented. TSMC nodes used in the manufacturing process of new Intel and AMD chips are described.